Thermo-Mechanical Reliability of TSV based 3D-IC
نویسندگان
چکیده
منابع مشابه
3D IC and Through-Silicon-Via (TSV) Reliability
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2017
ISSN: 1226-9360
DOI: 10.6117/kmeps.2017.24.1.035